| Basic Knowledge |
IPC/9704 foundation
IPC (originally founded as the Institute for Printed Circuits and now known as IPC: Association Connecting Electronics Industries) is a global trade association dedicated to the competitive excellence and financial success of its 2,600 member companies that represent all facets of the electronics interconnect industry, including design, PCB manufacturing, and electronics assembly.
IPC and the Joint Electron Device Engineering Council (JEDEC) released two guideline documents in 2004/2005 regarding mechanical stresses on PCBs. IPC/JEDEC-9702 is a strain characterization guideline and IPC/JEDEC-9704 focuses on printed wiring board strain gage tests.
The IPC/JEDEC-9704 document gives specific guidelines for strain gage testing for PCB assemblies in the board manufacturing process including, assembly, test, system integration and board shipping. According to the IPC/JEDEC-9704 guideline document, you can quantitatively assess and characterize potential high-stress-inducing and damaging processes. And the manufacturing steps typically characterized including PCB style, choose strain gages, the stick position, lead wire path, strain calibration, data analysis and so on.
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Industry Automation
